A variety of circuit card assemblies can be manufactured:

• Mixed technology (surface mount and through hole) circuits
• Double-sided surface mounted sub-assemblies
• Sub-assemblies with a variety of surface-mount components on a range of substrate materials

Circuit cards can be produced with:

• Population of 6500 surface mount components per hour
• +/-0.025mm placement accuracy
• Device pitch 0.3mm
• Maximum device size of 56mm sq.
• Variety of substrate materials including flexi-rigid boards
• Board sizes up to 585mm x 400mm

The comprehensive range of process capabilities allows production of many different component types:

• Full Range of Passive (smallest - 0201)
• Plastic Electronic Devices (controlled storage & monitoring)
• Ball Grid Arrays (0.8 mm pitch, 1600 ball)
• Large Quad Flatpacks (240 Lead; 56 mm x 56 mm)

A wide variety of production processes are available for circuit card assembly. These include:

• Automated component preparation and handling
• Simulation of challenging & hostile operational environments
• Crop & Form
• Component Tinning/degolding
• Surface Mount Pick & Place systems
• Additional facilities for through-hole components
• Semi-automatic assembly for conventional components
• Soldering
• Rework

The production facilities are complemented by an extensive range of post-production test facilities:

• Generic Flying Probe
In Circuit Test
• Automatic Insulation/Continuity Testing (DITMCO)
Generic Facility
• Hostile Environment Simulation
Passive and Active Thermal Stress Screening